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Hardware Specifications

Module-Level Specifications​

Key specifications for each physical module in NE503:

Core Processing Board​

TypeSpecifications
CPU / SoCQuad-core Arm Cortex-A53, 1.3 GHz; AI performance up to 20 TOPS; ISP supports up to 12 MP resolution, 600 Mpixel/s pixel rate, HDR and noise reduction; VPU supports H.265/H.264 encoding
LPDDR44 GB or 8 GB; the documented 8 GB configuration is 4266 Mb/s with 8.5 GB/s single-channel bandwidth; the 4 GB configuration follows its BOM
eMMC64 GB
QSPI Flash8 MB, Quad SPI protocol, standby current 8 µA, erase cycles > 100,000
Temperature Sensor12-bit resolution, 0.0625°C, I2C interface
EEPROM2 Kb (256 × 8), I2C interface, standby current < 1 µA, 1,000,000 write cycles
PCIe Clock Generator25 MHz, full-output operating current (IDD) 15 mA, low-jitter PCIe Gen4: 0.3 ps
Ethernet PHY10/100M Ethernet, RMII interface, IO voltage 1.6V ~ 3.6V
Inertial Measurement Unit (IMU)Integrated 3-axis digital accelerometer (programmable, max ±16 g) and 3-axis digital gyroscope (up to ±4000 dps)

Interface Board​

TypeSpecifications
MCUArm Cortex-M0+, 64 MHz, 512 KB Flash, 144 KB RAM
Temperature SensorAnalog output, -50°C ~ 150°C
Lens DriverLens options are AF Lens (44.5° HFOV) or Motorized Zoom (110° HFOV); the driver device and available controls depend on the specific SKU/BOM and firmware
Audio CodecI2S interface, controlled by the processing board

External Modules​

TypeSpecifications
Image Sensor1/1.8-inch 4K CMOS image sensor, up to 60fps 4K full-pixel output

Light Board (Independent Module)​

TypeDescription
Dual-Light BoardWhite + Red LED, PWM dimming, connected to interface board via connector
IR Light BoardNear-IR + Far-IR LED, PWM dimming, connected to interface board via connector

Operating Environment​

ParameterSpecification
Operating Temperature-40 ~ 60°C
Relative Humidity0 ~ 95% non-condensing

Version History​

VersionDateChanges
V1.02026-04-02Initial release